hi,
is wake-on-lan supported ?
how warm/hot do the LP version get when running 24/7 (mosty idle'ing) ?
is it possible to read the temperatures with programs like speedfan ?
is there an IR Receiver in the unit and will it be enabled later on, or does it lack the IR hardware ?
I want to get the LP version for my Domotica (HomeSeer), but I've read things about the fit-PC2 getting warm/hot without the optional external heat-sink
WoL and thermal characteristics
Re: WoL and thermal characteristics
WoL is implemented but yet to be validated.is wake-on-lan supported ?
Yes.is it possible to read the temperatures with programs like speedfan ?
There is IR hardware but we cannot guarantee that IR will function in pilot batch with SW update. Better to assume the function is missing.is there an IR Receiver in the unit and will it be enabled later on, or does it lack the IR hardware ?
fit-PC3 Thermal design is better than fit-PC2. In particular the LP version runs much cooler. For example - see a thermal image of fit-PC3 Basic playing HD movie at 12W (25C ambient). I expect HomeSeer on fit-PC3-LP to consume even less.I want to get the LP version for my Domotica (HomeSeer), but I've read things about the fit-PC2 getting warm/hot without the optional external heat-sink
Re: WoL and thermal characteristics
Great, thanks, just ordered the LP version 

Re: WoL and thermal characteristics
In relation to your original comment tCC I've been running a Fit-PC2 24/7 since 2009 without a heatsink. It does get warm when it's under load for hours, but all fanless PCs do. The metal case dissipates the heat very well and I've never had any instability problems whatsoever. I think some have an unrealistic expectation that the case should always be cool to the touch just like their desktop PCs loaded with fans, but for passively cooled devices getting that heat out of the case is a good thing.
Re: WoL and thermal characteristics
Where is the location of the CPU/GPU in relationship to the HD? I'm worried about heat in relation to the HD/Msata SSD. I like the size of the Fit PC3 Basic, but also like the extra cooling of the Fit PC3 Pro with the ribs.
Currently, I have a PC2 that runs 24/7/365, with the optional Heat sink, that runs fairly cool. I'm real happy with it but I boot from a 2.5" SSD and keep my media on an external USB HD. The idea with the PC3 is to boot from an Msata SSD and keep my media on a 2.5" mechanical drive so everything is inside the PC3 case.
I can care less about the IR not working because I will never use it. The unit will sit on a shelf in a closet and run headless.
Thanks again,
Currently, I have a PC2 that runs 24/7/365, with the optional Heat sink, that runs fairly cool. I'm real happy with it but I boot from a 2.5" SSD and keep my media on an external USB HD. The idea with the PC3 is to boot from an Msata SSD and keep my media on a 2.5" mechanical drive so everything is inside the PC3 case.
I can care less about the IR not working because I will never use it. The unit will sit on a shelf in a closet and run headless.
Thanks again,
Re: WoL and thermal characteristics
I wouldn't be worried about the CPU radiating on the HDD - they are on opposing sides of the motherboard with sufficient clearance, but if your cabinet is not ventilated then there will be more heat build-up in still air. The ribs would add little in this scenario.
A good setup would be to place fit-PC3 in the open. If not possible you can take advantage of the eSATA for a data hard disk placed away.
A good setup would be to place fit-PC3 in the open. If not possible you can take advantage of the eSATA for a data hard disk placed away.
Re: WoL and thermal characteristics
Thanks for the quick reply.
There is plenty of ventilation in the place where i will keep the Fit PC3. The idea is to keep everything inside of the Fit PC3 case. I want to keep it neat and tidy and not use external drives.
Would it be fair to assume that the Fit PC3 Basic and the Fit PC3 Pro run at about the same temperature?
Thanks again,
There is plenty of ventilation in the place where i will keep the Fit PC3. The idea is to keep everything inside of the Fit PC3 case. I want to keep it neat and tidy and not use external drives.
Would it be fair to assume that the Fit PC3 Basic and the Fit PC3 Pro run at about the same temperature?
Thanks again,
Re: WoL and thermal characteristics
fit-PC3 does case-temperature monitoring and regulates P-states accordingly, so the short answer is yes. The actual power consumption depends on system load so there is no definite answer which one will run cooler.Would it be fair to assume that the Fit PC3 Basic and the Fit PC3 Pro run at about the same temperature?
Re: WoL and thermal characteristics
I don't think so, it may make a difference. From what I can see the ribbed model has a significantly larger surface, and a larger surface would dissipate additional energy by radiation. I haven't made any measurements, though, it's just a thought.irads wrote:... if your cabinet is not ventilated then there will be more heat build-up in still air. The ribs would add little in this scenario.
Re: WoL and thermal characteristics
True, but you don't want to be at a temperature where radiation is significant compared to convection. We are yet to run more tests on the ribbed housing to estimate the behavior.